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  • 芯片焊接机

      Datacon 2200 evo
      The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
      Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

      Datacon 2200 evo goes PLUS!

      • PLUS accuracy
      • PLUS productivity
      • PLUS flexibility
      • Multi-chip capability
      • Flexibility for customizing
      • Open platform architecture



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